Our engineers have the capability to accelerate the aging of electronics systems to predict long term life. Our aging chambers can expose electronic assemblies to challenges such as mixed corrosive gases, thermal cycling, and moisture, while monitoring the operation of the electronics to determine exactly when failure occurs. We have used this approach to evaluate the long term reliability of lead free solder materials, and developed methodologies for predicting the reliability of dormant missile systems.
Methodologies for Predicting Dormant Missile Reliabilities
Reliability of weapon systems through periods of storage dormancy has long been a significant concern…
Assessing the Impact of Lead-free Solders on the Long-term Reliability of Weapon System Electronics
Lead based solders were used for decades to make conductive and structural connections in electronic…
Multi-Stress Chamber for Accelerated Life Testing of Plastic Encapsulated Microcircuits
Verification testing of TRI Austin’s Plastic Encapsulated Microcircuit/Environmental Evaluation Chamber (PEM/EEC) were carried out in…